Probe insertion auxiliary and method of probe insertion

ABSTRACT

A probe insertion auxiliary and a method of probe insertion are provided. A light source illuminates holes on a lower die to make the position of the holes clear for an operator. The probe insertion auxiliary includes a bottom and a clamp pair disposed on the bottom. The clamp pair has two clamp parts. The two clamp parts define a slit for disposing a probe chassis. Furthermore, the two clamp parts and the bottom form a space. A light source is disposed inside the space for illuminating the holes.

CROSS REFERENCE TO RELATED APPLICATIONS

This patent application is a divisional application of and claimspriority to U.S. patent application Ser. No. 13/031,589, filed on Feb.21, 2011, and entitled “PROBE INSERTION AUXILIARY AND METHOD OF PROBEINSERTION” the entire contents of which are incorporated herein byreference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a probe insertion auxiliary, and moreparticularly to an auxiliary for inserting probes onto a probe card.

2. Description of the Prior Art

In general, semiconductor products are manufactured by performing acomplex series of processes such as manufacturing a silicon wafer andforming patterns on the silicon wafer to fabricate semiconductor dies.

When processing wafers of a semiconductor, to determine if dies on awafer are good or bad, a test bench and a probe card are required toperform testing. A precise contact mechanism is provided on the probecard to contact each die on the wafer as well as a conduction circuitwhich performs an electrical test, so as to assure that the electricalproperties and performance of the dies are manufactured according to thedesign specification.

Please refer to FIG. 1. FIG. 1 depicts a side view of a conventionalprobe card schematically. As shown in FIG. 1, a probe card 10 comprisesa probe head 12. The probe head 12 includes four parts: an upper die 14,a film 16, a lower die 18 and probes 20. Each of the probes 20penetrates the upper die 14, the film 16 and the lower die 18. Theposition of each of the probes 20 corresponds to the test pads 24 on thesemiconductor wafer 22. Furthermore, the probe card 10 has a substrate26 and a printed circuit board (PCB) 28. One side of the substrate 26contacts the probes 20 and the other side of the substrate 26 contactsthe PCB 28. The substrate 26 converts the signal of the probes 20 to thePCB 28. It should be noted that the distance between each probe 20 isaround 50 to 100 μm. Furthermore, each of the probes 20 is not straight,and has a zigzag-shaped part 30.

Currently, the probe insertion process is performed by penetrating eachprobe through the lower die and the film by hand. When all the probesare penetrated and fixed on the lower die and the film, the upper diethen covers the film. Because the density of the probes is high, andthere is a zigzag part on each probe, however, it is hard for theoperator to penetrate the probe through the lower die and the film byhand based on experience only.

SUMMARY OF THE INVENTION

In light of the above, a probe insertion auxiliary is provided in thepresent invention to help probes be inserted easily.

According to a preferred embodiment of the present invention, a probeinsertion auxiliary includes: a bottom, a clamp pair disposed on thebottom, the clamp pair having two clamp parts, the two clamp partsdefining a slit for engaging a probe chassis, and the two clamp partsand the bottom forming a space; and a light source disposed inside thespace for illuminating the holes on the probe chassis.

According to another preferred embodiment of the present invention, amethod of probe insertion includes: first, a probe insertion auxiliaryis provided, where the probe insertion auxiliary comprises: a bottom, aclamp pair disposed on the bottom, the clamp pair having two clampparts, the two clamp parts defining a slit, and the two clamp parts andthe bottom forming a space wherein alight source is disposed inside thespace. Later, a probe chassis is put into the slit, wherein the probechassis has a plurality of holes, and the light source illuminates theholes. Finally, a probe insertion process is performed.

As the size of a die becomes smaller, the probes and the holes on theprobe chassis shrink as well. Therefore, the insertion of the probesbecomes harder and harder. The probe insertion auxiliary of the presentinvention can make the probe insertion process easier by illuminatingthe lower die using a light source during the insertion process.

These and other objectives of the present invention will no doubt becomeobvious to those of ordinary skill in the art after reading thefollowing detailed description of the preferred embodiment that isillustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 depicts a side view of a conventional probe card schematically.

FIG. 2 depicts a probe insertion auxiliary of the present inventionschematically.

FIG. 3 depicts a magnified diagram of the light source.

FIGS. 4a-7b depict a method of probe insertion of the present invention,wherein:

FIG. 4a depicts a probe insertion auxiliary and a probe chassis;

FIG. 4b depicts a side view of a probe chassis along the line AA' shownin FIG. 4a ;

FIG. 5a depicts a probe insertion auxiliary engaging a probe chassis;

FIG. 5b depicts a side view of a probe chassis and a light source alongthe line BB' shown in FIG. 5a ;

FIG. 6 depicts a rectangular probe chassis engaged with the probeinsertion auxiliary;

FIG. 7a depicts a probe penetrating a hole of a lower die; and

FIG. 7b depicts a side view of a probe chassis along the line CC' shownin FIG. 7 a.

DETAILED DESCRIPTION

FIG. 2 depicts a probe insertion auxiliary of the present inventionschematically. As shown in FIG. 2, the probe insertion auxiliary 100 hasa bottom 40. The bottom 40 may be in the shape of a rectangle having ashort side and a long side, but is not limited to this shape. Two bodies42, 44 comprise a body pair 46. The two bodies 42, 44 are disposed attwo opposing sides of the bottom 40. For example, the two bodies 42, 44can be disposed on the two opposing short sides of the bottom 40. Tworods 48, 50 are disposed between the bodies 42, 44. Two ends of each ofthe two rods 48, 50 are fixed on the opposing surfaces of the two bodies42, 44. Furthermore, a clamp pair 56 consisting of two clamp parts 52,54 is disposed on the bottom 40. The clamp pair 56 is disposed betweenthe two bodies 42, 44. The two clamp parts 52, 54 are penetrated by thetwo rods 48, 50 so that the two clamp parts 52, 54 can move freely alongthe extending direction of the rods 48, 50, and change the relativeposition of the two clamp parts 52, 54. The relative positions of thetop portions of the two clamp parts 52, 54 define a slit 58 with anadjustable size. The slit 58 is for containing a probe chassis (notshown). Moreover, two fixing parts 60, 62 are disposed on the clampparts 52, 54, respectively. When the clamp parts 52, 54 are moved tosuitable relative positions, the fixing parts 60, 62 can be used to fixthe positions of the clamp parts 52, 54. Moreover, the bodies 42, 44limit the positions of the clamp parts 52, 54 between the bodies 42, 44.

Slit 58 includes a first region A and a second region B. The firstregion A has a shape which is a counterpart of a circle. For example,the shape of the first region A can be an arc so that the first region Acan be engaged with a circle probe chassis. The second region B has ashape which is a counterpart of a rectangular. For example, the shape ofthe second region B can be a line or an angle, so that the second regionB can be engaged with a rectangular probe chassis. Furthermore, the slit58 has a bottom surface 64 and a side surface 66. The side surface 64 isused to support the probe chassis, and the side surface 66 is forengaging the probe chassis inside the slit 58. According to a preferredembodiment of the present invention, the width of the bottom surface 64is 5 mm, and the width of the side surface 66 is 3 mm.

It is noteworthy that the lower part of the two clamp parts 52, 54together with the bottom 40 forms a space 68. A light source 70 can bedisposed inside the space 68 for illuminating the probe chassis insidethe slit 58. The switch 72 of the light source 72 can extend from thespace 68, and be disposed outside of the probe insertion auxiliary 100.The light source 70 preferably has a sufficient light that can passthrough the probe chassis and reach the operator's eyes. FIG. 3 depictsa magnified diagram of the light source. As shown in FIG. 3, lightsource 70 can be an LED matrix with an area of 4 cm×4 cm formed bynumerous LEDs 74. Alternatively, the light source 70 can be at least alight bulb. Furthermore, at least an alignment film 78 and at least apolarizing film 76 are disposed on the light source 70. According to apreferred embodiment of the present invention, six alignment films 78and one polarizing film 76 can make light from the light source 70become uniform.

FIGS. 4a-7b depict a method of probe insertion of the present invention.FIG. 4b depicts a side view of a probe chassis along the line AA' shownin FIG. 4a . FIG. 5b depicts a side view of a probe chassis and a lightsource along the line BB' shown in FIG. 5a . FIG. 7b depicts a side viewof a probe chassis along the line CC' shown in FIG. 7a .

As shown in FIGS. 4a and 4b , first, a probe insertion auxiliary 100(shown in FIG. 2) and a probe chassis 80 are provided. The probe chassis80 includes a film 84 and a lower die 82. The lower die 82 has numerousholes 86 thereon. In FIG. 4a , the probe chassis is a circular shape;however, for different products, the probe chassis can have differentshapes.

Then, as shown in FIGS. 5a and 5b , the probe chassis 80 is disposedinside the slit 58 with the lower die 82 facing up. The position of theclamp parts 52, 54 is adjusted to contact the probe chassis 80 after theprobe chassis 80 is inside the slit 58. Later, the relative positions ofthe clamp parts 52, 54 are fixed by the fixing parts 60, 62. In FIG. 5a, the probe chassis 80 is in the shape of a circle. The probe chassis 80is engaged with the slit 58 by the first region A. Then, the lightsource 70 is turned on, and the light from the light source 70 passesthrough the probe chassis 80 along a first direction. In detail, thelight from the light source 70 passes through the film 84, and laterpasses through the holes 86 on the lower die 52. Finally, the light fromthe light source 70 enters the operator's eyes. FIG. 6 depicts arectangular probe chassis engaged with the probe insertion auxiliary. Asshown in FIG. 6, the probe chassis 80 can be rectangular. Therectangular probe chassis 80 is engaged with the slit 58 by the secondregion B.

As shown in FIGS. 7a and 7b , a probe 121 penetrates the hole 86 in asecond direction. In detail, the probe 121 penetrates the hole 86 of thelower die 82, then continues to penetrate the film 84. Therefore, thesecond direction is parallel to the first direction. The probe 121 canbe a vertical probe with a zigzag-shaped part or any other kinds ofprobe. When performing the probe insertion process, the light source 70illuminates the holes 86 to make the holes bright, so that the operatorcan see the position of the holes 86 clearly and correctly. Therefore,even an inexperienced operator can insert the probe precisely. After allprobes are inserted, the upper die can be covered on the probe chassis.At this point, the upper die, the film, the lower die and the probescomprise a probe head. Finally, the probe head is fixed with the probecard.

Because the probe tip contacts the test pad on the semiconductor waferduring testing, the probe tip may be worn down after numerous testing.At this point, the ruined probe needs to be replaced by a new probe. Theprobe insertion auxiliary of the present invention can help with thereplacement of the probe. Furthermore, when a new semiconductor wafer isproduced, a new probe layout is designed to match the new semiconductorwafer. At this point, the probe insertion auxiliary of the presentinvention can be used to insert the probes onto the probe card.

The probe insertion auxiliary of the present invention is suitable formany types of probe chassis. An operator can adjust the clamp parts ofthe probe insertion auxiliary to match the size of the probe chassis.Moreover, the light source illuminates the holes on the lower die andilluminates the film so the operator can see the holes clearly.Therefore, the probe can be inserted more precisely.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the invention. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

What is claimed is:
 1. A method of probe insertion, comprising:providing a probe insertion auxiliary, the probe insertion auxiliarycomprising: a bottom; a clamp pair disposed on the bottom, the clamppair having two clamp parts, the two clamp parts defining a slit, andthe two clamp parts and the bottom forming a space; and a light sourcedisposed inside the space; putting a probe chassis into the silt,wherein the probe chassis has a plurality of holes, and the light sourceilluminates the plurality of holes; and performing a probe insertionprocess.
 2. The method of probe insertion of claim 1, wherein the probechassis comprises a film and a lower die.
 3. The method of probeinsertion of claim 1, wherein the lower die comprises the plurality ofholes.
 4. The method of probe insertion of claim 3, wherein the probeinsertion process comprises using the probe to penetrate one of theholes on the lower die, then continuing to penetrate the film with theprobe.
 5. The probe insertion auxiliary of claim 1, wherein the lightsource comprises a plurality of LEDs.
 6. The probe insertion auxiliaryof claim 1, wherein the light source comprises a plurality of lightbulbs.
 7. The probe insertion auxiliary of claim 1, wherein at least onepolarizing film and at least one alignment film are disposed on thelight source.
 8. The probe insertion auxiliary of claim 1, wherein thesize of the slit is adjusted by changing the relative positions of thetwo clamp parts.